What we serve For electronics
Thermal management
• High momentum from E-mobility Market
• Highly focus on thermal and electrical performance
Typical application we serve:
• Thermal interface materials for battery assembly
• Electric motor potting
• Sensor potting
Semiconductor packaging
• High dynamics in miniaturization
Typical application we serve:
• Conformal coating
• Underfill / die attach
• Different types of encapsulation
Copper Clad Laminate (CCL)
• 5G with high frequency demand
• High electrical performance
Typical application we serve:
• Rigid CCL prepreg
• Flexible CCL adhesion
RAW MATERIALS WE SERVE:
Chemistry | What we offer here | Our brand |
|---|
Silicones
| Addition-curing portfolio | Polymer VS, Modifier, VQM,
Crosslinkers, Catalysts, Inhibitors, Reactive plasticizers |
| Condensation-curing portfolio | Polymer OH, Modifier OH,
Catalysts TD 18, Crosslinker OX |
| Performance compounds for thermal management | TEGOSIL Heatban®, TEGOSIL® FR, TEGOSIL® HT |
| Functional filler dispersants | TEGOPREN®, TEGOMER® |
Silane modified polymers | Silane modified polymers | Polymer ST, TEGOPAC® |
| Functional filler dispersants | TEGOPREN®, TEGOMER® |
Reactive resins | Nanosilica in epoxies, acrylic monomers and solvents | NANOPOX®, NANOCRYL®, NANOPOL® |
| Core-shell silicone rubber in epoxies and polyol | ALBIDUR® EP, ALBIDUR® PU |
| Epoxy-silicone block copolymers | ALBIFLEX® |
| Silane modified polymers | Polymer ST, TEGOPAC® |
| Functional filler dispersants | TEGOPREN®, TEGOMER® |
Thermoplastic resins | Functional filler dispersants | TEGOPREN®, TEGOMER® |
Product Overview
our product portfolio by functions:
