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TEGOPAC® Product Line

SOLUTIONS FOR ADHESIVES & SEALANTS


  • TEGOPAC® Bond 160

    TEGOPAC® Bond 160 is a silylated polymer that is used for production of neutral curing adhesives and sealants. The polymer is based on a unique polymer technology with lateral crosslinking groups. TEGOPAC® Bond 160 shows excellent through cure properties, improved water & thermal resistance and excellent elastic recovery properties. The low polymer viscosity allows quick & easy handling.

  • TEGOPAC® Bond 170

    TEGOPAC® Bond 170 is a silylated polymer that is used for production of neutral curing adhesives and sealants. The polymer is based on a unique polymer technology with lateral crosslinking groups. TEGOPAC® Bond 170 shows excellent through cure properties, improved water & thermal resistance and excellent elastic recovery properties. The low polymer viscosity allows quick & easy handling.

  • TEGOPAC® Bond 251

    TEGOPAC® Bond 251 is a hybrid polymer with a modified backbone that contains hydrophilic segments. With TEGOPAC® Bond 251 it is possible to formulate adhesive and sealant formulations with excellent elastic recovery properties. Formulating with various plasticizers, fillers, and other additives is possible to address applications like assembly adhesives, roof sealing applications or pressure sensitive adhesives. It is possible to blend TEGOPAC® Bond 251 with epoxy polymers. The selective adjustment in the polymer backbone allows TEGOPAC® Bond 251 to develop excellent bonding properties to many different substrates, e.g. metals, ceramics, wood, concrete, mortar. It is possible to formulate methanol-free formulations with a convenient reactivity.

  • TEGOPAC® Seal 100

    TEGOPAC® Seal 100 is a moisture curing silane-modified polymer recommended for low modulus sealant formulations which are used in construction applications (e.g. for façades, expansion joints, etc. ) or for indoor applications. TEGOPAC® Seal 100 is also recommended for use in sealant and adhesive formulations where vibration and sound dampening is an issue.