Reactive Adhesives & Sealants
Evonik’s silane-modified product range is based on two different polymer technologies:
Polymer ST and TEGOPAC®. The Polymer ST portfolio covers a very broad range of mechanical properties: Polymers allow the formulator to produce from a very soft sealant up to a very tough adhesive. Solutions for parquet adhesives are also available. The TEGOPAC® family differs from standard silane-modified polymers: polymers are based on a unique polymer technology with lateral crosslinking groups. Sealant and adhesive formulations with TEGOPAC® polymers show excellent through cure properties, improved water & thermal resistance and good elastic recovery properties. The polymers release ethanol during the curing process.
- Polymer ST 48
Polymer ST 48 is especially recommended for the application as sealant for interior or exterior joints, e.g. expansion or connection joints, inte-rior joints for dry walling, joints at staircases.
- Polymer ST 61
Polymer ST 61 is a silane-terminated polymer, that is free of plasticizers. Showing both ex-cellent tensile strength and good elongation makes it suitable for demanding wood floor adhesives. With Polymer ST 61 it is possible to formulate either high strength or soft and elastic wood floor adhesives.
- Polymer ST 61 LV
Polymer ST 61 LV for high quality wood floor adhesives with high strength and elasticity. Polymer ST 61 LV is a plasticizer free product which addresses the same formulation properties as Polymer ST 61. Its viscosity is approx. 70 % less, thus it allows quicker dosing, lower formulation viscosities and higher possible filler loading levels.
- Polymer ST 77
Polymer ST 77 is free of phthalates and is highly recommended for demanding applications where a balanced stress-strain behavior is re-quired as in transport and assembly applica-tions. Examples for the use of Polymer ST 77-based formulations are the assembly of superstructural parts, bumpers, etc. Mechanical fastening is often avoided as it could cause damage to the materials used. In addition, it could negatively affect the design.
- Polymer ST 80
The specific product design of Polymer ST 80 enables formulators to produce adhesives with high strength combined with an exceptional surface hardness. Therefore, it is possible to address applications that require lower Shore D levels. Today such applications are mostly addressed through 2C-polyurethanes or epoxy putties.
- Polymer ST 81
Polymer ST 81 addresses applications where tensile strength of >> 6N/mm² is required. This is especially important in applications that are covered by 1C and 2C-polyurethanes today. Showing an outstanding high tensile strength Polymer ST 81 allows formulators to enter mar-kets such as wood construction, transport and automotive, assembly as well as light-weight construction.
- TEGOPAC® Bond 160
TEGOPAC® Bond 160 is a silylated polymer that is used for production of neutral curing adhesives and sealants. The polymer is based on a unique polymer technology with lateral crosslinking groups. TEGOPAC® Bond 160 shows excellent through cure properties, improved water & thermal resistance and excellent elastic recovery properties. The low polymer viscosity allows quick & easy handling.
- TEGOPAC® Bond 170
TEGOPAC® Bond 170 is a silylated polymer that is used for production of neutral curing adhesives and sealants. The polymer is based on a unique polymer technology with lateral crosslinking groups. TEGOPAC® Bond 170 shows excellent through cure properties, improved water & thermal resistance and excellent elastic recovery properties. The low polymer viscosity allows quick & easy handling.
- TEGOPAC® Bond 251
TEGOPAC® Bond 251 is a hybrid polymer with a modified backbone that contains hydrophilic segments. With TEGOPAC® Bond 251 it is possible to formulate adhesive and sealant formulations with excellent elastic recovery properties. Formulating with various plasticizers, fillers, and other additives is possible to address applications like assembly adhesives, roof sealing applications or pressure sensitive adhesives. It is possible to blend TEGOPAC® Bond 251 with epoxy polymers. The selective adjustment in the polymer backbone allows TEGOPAC® Bond 251 to develop excellent bonding properties to many different substrates, e.g. metals, ceramics, wood, concrete, mortar. It is possible to formulate methanol-free formulations with a convenient reactivity.
- TEGOPAC® Seal 100
TEGOPAC® Seal 100 is a moisture curing silane-modified polymer recommended for low modulus sealant formulations which are used in construction applications (e.g. for façades, expansion joints, etc. ) or for indoor applications. TEGOPAC® Seal 100 is also recommended for use in sealant and adhesive formulations where vibration and sound dampening is an issue.